Press Releases

September 30, 2015

Fiber Lasers: Scribing of Ceramic Wafers

View PDF, View PDF in German Scribing and micromachining of AlN and Al2O3 ceramics has been dominated by the use of CO2 lasers for 30 years, the simple reason being that the 10.6 μm wavelength has been the best suited to processing these types of materials. Nevertheless, feature size and finish quality of the ceramic substrates used for electronics applications […]
September 29, 2015

Processing Ceramic Substrates

Laser technology has been widely used for processing alumina (Al2O3) and aluminum nitride (AlN) ceramic substrates for the electronics industry for 30 years. For separating the ceramic substrates into individual components, the laser is used to scribe (drill) a series of partial (blind), high-tolerance holes. These holes penetrate roughly one-third of the way through the substrate and will generate a […]