Published by admin at September 29, 2015 Laser technology has been widely used for processing alumina (Al2O3) and aluminum nitride (AlN) ceramic substrates for the electronics industry for 30 years. For separating the ceramic substrates into individual components, the laser is used to scribe (drill) a series of partial (blind), high-tolerance holes. These holes penetrate roughly one-third of the way through the substrate and will generate a […]